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IPC TM-650 2.4.47
Flux Residue Dryness
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:47:52Z | |
| date available | 2017-09-04T15:47:52Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | PZPNCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/50797 | |
| description abstract | This test method specifies a qualitative method for assessment of the tackiness of soft soldering flux residues. The method is applicable to fluxes of types L and M. the method is particularly appropriate for applications where flux residues are left in place on soldered electronic and electrical equipment. | |
| language | English | |
| title | IPC TM-650 2.4.47 | num |
| title | Flux Residue Dryness | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |
