درباره ما
IPC TM-650 2.4.13.1
Thermal Stress of Laminates
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:47:15Z | |
| date available | 2017-09-04T15:47:15Z | |
| date copyright | 34669 | |
| date issued | 1994 | |
| identifier other | PXSHCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/50070 | |
| description abstract | This test method is designed to determine the thermal integrity of unclad or metallic clad laminates using short-term solder exposure. | |
| language | English | |
| title | IPC TM-650 2.4.13.1 | num |
| title | Thermal Stress of Laminates | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1994 | |
| contenttype | fulltext |
