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IPC TM-650 2.5.3B
Current Breakdown, Plated Through-Holes
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:07:14Z | |
| date available | 2017-09-04T15:07:14Z | |
| date copyright | 08/01/1997 | |
| date issued | 1997 | |
| identifier other | LHHXCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/4932 | |
| description abstract | To determine if the plated through-holes are sufficiently plated to withstand a relatively high current potential. | |
| language | English | |
| title | IPC TM-650 2.5.3B | num |
| title | Current Breakdown, Plated Through-Holes | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1997 | |
| contenttype | fulltext |
