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IPC TM-650 2.2.13.1A
Thickness, Plating in Holes Micro-Ohms Method
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:41:13Z | |
| date available | 2017-09-04T15:41:13Z | |
| date copyright | 01/01/1983 | |
| date issued | 1983 | |
| identifier other | PGBKCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/43462 | |
| description abstract | A nondestructive inspection method for determining the quality of plated-through connections in printed wiring boards. 1.2 Theory. Copper will display a resistivity of known value depending upon the geometry of the shell and the conductivity of the copper. If the shell is not uniform, defects such as cracks, voids, or thin spots in the copper will cause the measured resistance to be higher than the theoretical value. This value is computed by using the equation given in Fig. 1. | |
| language | English | |
| title | IPC TM-650 2.2.13.1A | num |
| title | Thickness, Plating in Holes Micro-Ohms Method | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1983 | |
| contenttype | fulltext |
