IPC 2517A
Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description [ASEMT]
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:41:05Z | |
| date available | 2017-09-04T15:41:05Z | |
| date copyright | 36831 | |
| date issued | 2000 | |
| identifier other | PFUSFBAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/43375 | |
| description abstract | This standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, and assembly manufacturers. The formats are also useful when the manufacturing cycle includes computer-aided processes and numerical control machines. The information can be used for both manual and for digital interpretation. The data may be defined in either English or SI units. | |
| language | English | |
| title | IPC 2517A | num |
| title | Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description [ASEMT] | en |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2000 | |
| contenttype | fulltext |

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