IPC TM-650 2.5.10.1

Insulation Resistivity for Adhesive Interconnection Bonds

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T15:38:36Z
date available	2017-09-04T15:38:36Z
date copyright	36100
date issued	1998
identifier other	OYRXHAAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/40692
description abstract	The purpose of this test method is to quickly assess the adequacy of a given Anisotropically Conductive Adhesive Film (ACF) construction and bonding process for avoiding short circuits between adjacent traces of a flex circuit being bonded to a low profile circuit substrate. Purpose ACF materials are often used to interconnect fine-pitch flexible circuitry to substrates such as flat-panel displays. A center to center pitch range of 80 μm to 200 μm is not uncommon in circuits for flat panel display applications. It is critical that the particle dispersion within the ACF be of sufficient quality such that there is no inherent tendency for short circuits between adjacent traces. In addition, it is important that a bonding process is used, which doesn't create any undue accumulation of particles, which will lead to short circuits.
language	English
title	IPC TM-650 2.5.10.1	num
title	Insulation Resistivity for Adhesive Interconnection Bonds	en
type	standard
page	2
status	Active
tree	IPC - Association Connecting Electronics Industries:;1998
contenttype	fulltext