درباره ما
IPC TM-650 2.3.17.1B
Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:30:19Z | |
| date available | 2017-09-04T15:30:19Z | |
| date copyright | 05/01/1998 | |
| date issued | 1998 | |
| identifier other | AWOXHAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/31668 | |
| description abstract | This test is to measure the flow properties of cast adhesive freefilms or coverfilms used in the manufacture of flexible circuitry. The test also provides a measure of the squeeze out, which might be expected to occur around terminal pads or other boundary spaces. It is not possible to define a universal set of laminating conditions that suit all of the various adhesive types. This test is dependent on sample preparation, which is consistent with good industry practice and in accordance with the suppliers' suggested laminating procedures. | |
| language | English | |
| title | IPC TM-650 2.3.17.1B | num |
| title | Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |
