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IPC TM-650 2.4.9.2
Bonding Process
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:29:11Z | |
| date available | 2017-09-04T15:29:11Z | |
| date copyright | 36100 | |
| date issued | 1998 | |
| identifier other | NWRXHAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/30352 | |
| description abstract | In order to assess the actual performance of any given lot of material, it is necessary to apply and thermally bond the material between the substrates of interest. This method describes the recommended procedure for both pretacking and bonding anisotropically conductive films (ACF). This method describes a fully manual procedure. | |
| language | English | |
| title | IPC TM-650 2.4.9.2 | num |
| title | Bonding Process | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |
