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IPC TM-650 2.5.27
Surface Insulation Resistance of Raw Printed Wiring Board Material
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:24:50Z | |
| date available | 2017-09-04T15:24:50Z | |
| date copyright | 03/01/1979 | |
| date issued | 1979 | |
| identifier other | NJOOCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/25317 | |
| description abstract | This test method is designed to determine the surface insulation resistance of dielectric material after the prescribed conditioning cycles. | |
| language | English | |
| title | IPC TM-650 2.5.27 | num |
| title | Surface Insulation Resistance of Raw Printed Wiring Board Material | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1979 | |
| contenttype | fulltext |
