IPC TM-650 2.4.34

Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipoise)

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T15:24:42Z
date available	2017-09-04T15:24:42Z
date copyright	01/01/1995
date issued	1995
identifier other	AULICAAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/25169
description abstract	The test specifies a standard procedure for determining the viscosity of solder paste in the range of 300,000 to 1,600,000 centipoise.
language	English
title	IPC TM-650 2.4.34	num
title	Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipoise)	en
type	standard
page	2
status	Active
tree	IPC - Association Connecting Electronics Industries:;1995
contenttype	fulltext