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IPC 9631 GERMAN
Users Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:24:22Z | |
| date available | 2017-09-04T15:24:22Z | |
| date copyright | 40513 | |
| date issued | 2010 | |
| identifier other | NIAECFAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/24745 | |
| language | English | |
| title | IPC 9631 GERMAN | num |
| title | Users Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation | en |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2010 | |
| contenttype | fulltext |
