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English -- Solderability Tests for Printed Boards;
German -- Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/ reflow- und/oder prozessempfindlicher Bauteile

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:17:11Z
date available2017-09-04T15:17:11Z
date copyright02/01/2012
date issued2012
identifier otherMMACCFAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/16541
languageEnglish
titleIPC IPC/JEDEC J-STD-033C GERMANnum
titleEnglish -- Solderability Tests for Printed Boardsen
titleGerman -- Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/ reflow- und/oder prozessempfindlicher Bauteileother
typestandard
page32
statusActive
treeIPC - Association Connecting Electronics Industries:;2012
contenttypefulltext


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