IPC TM-650 2.2.4C
Dimensional Stability, Flexible Dielectric Materials
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:11:53Z | |
| date available | 2017-09-04T15:11:53Z | |
| date copyright | 05/01/1998 | |
| date issued | 1998 | |
| identifier other | LVOXHAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/10310 | |
| description abstract | This test method is used to establish and define the procedures for determining thermal gradient dimensional changes of a plastic dielectric, metal clad or unclad. This method may also be used to determine dimensional changes after metal removal of a clad. | |
| language | English | |
| title | IPC TM-650 2.2.4C | num |
| title | Dimensional Stability, Flexible Dielectric Materials | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |

درباره ما