MSFC-SPEC-3659

Abstract

This document establishes criteria for the processes involved in electrical bonding of semipermanent, metal-to-metal joints (joints held together by bolts, rivets, clamps, etc.) and indirect bonds for equipment and elements manufactured at the Marshall Space Flight Center (MSFC). <br>There are two types of electrical bonds: direct and indirect. Direct bonds are metal-to-metal joints provided by welding, riveting or bolting. Indirect bonds are connected through a strap or jumper. Joints formed by welding, brazing or sweating are inherently bonded provided that proper procedures are followed to ensure no impurities or imperfections are incorporated in the joint. <br><u><strong>Purpose</strong></u> <br>This document has two purposes: <br>1. To provide a minimum set of process control requirements to be used in implementing electrical bonds. <br>2. To provide a specification for callout on mechanical drawings.